Tensile behavior of pb-sn solder/cu joints
نویسندگان
چکیده
منابع مشابه
The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints
A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1Sn0.8 was observed to form at the Pb-Sn solder/Ni3Sn4 interface during annealing a...
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Experimental research on the Pb phase coarsening of eutectic Pb/Sn flip chip solder joint under current stressing is reported. Phase growth is observed under different current densities and temperatures. Higher current density leads to faster grain coarsening. Based on the test results, a grain coarsening equation including the influence of current density is proposed, dn dn 0 1⁄4 Kjmt. The cur...
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Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatures and five at the higher temperatures. The specimens were tested in the as-fabricated condition or after having been subjected to one of two air a...
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Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
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Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
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ژورنال
عنوان ژورنال: Journal of Electronic Materials
سال: 1987
ISSN: 0361-5235,1543-186X
DOI: 10.1007/bf02655488